Education Experience 1. Jan. 2010-Dec. 2015, Ph.D, Division of Microelectronics,EEE, Nanyang Technological University, Singapore 2. Aug. 2006-Jul. 2009, Master of Engineering, Microelectronics and Solid State Electronics ,Beijing University of Technology, China 3. Aug. 2000-Jul. 2004, B. Eng. of Applied physics Shenyang University of Technology, China. Work Experience 1. Aug. 2004 –Aug. 2006, Lithography Process Engineer, CSMC Technologies Corporation 2. Jul. 2009 –Dec. 2009, Process Integrated Engineer, CSMC Technologies Fab 2 Co., Ltd 3. Feb. 2014-Sep.2014, Senior Engineer, United Microelectronics Corporation, Singapore 4. Sep. 2014- Jul. 2022, Engineer, Southern university of Science and technology 5. Jul. 2022- now, Shenzhen Technology University

Education Experience | 2017-2022, Zhejiang University of Technology, College of Mechanical Engineering, Doctor of Engineering | 2004-2007, Shenzhen University, School of Engineering, Master of Science | 1997-2001, University of Science and Technology of China, Department of precision machinery and precision instrument, Bachelor of Engineering. Work Experience | 2018-Present, Shen Zhen Technology University, Sino-german College of Intelligent Manufacturing，Senior Experimentalist | 2007-2017, Guangzhou Ante Laser CO.,LTD. , R&D Director | 2001-2004, Guangdong Luan Industry and Commerce CO.,LTD. ,Project Manager

Education Experience | 2013.2-2014.7，The University of New South Wales in Australia，major in Signal Processing，postgraduate student； | 2008.9-2012.6，Nanjing University of Aeronautics and Astronautics，major in Electrical engineering and the automatization，undergraduate. Work Experience | 2019.9-now，Intermediate technician，Sino-German College of Intelligent Manufacturing，SZTU； | 2014.12-2018.7，Hardware Engineer、System Engineer，Military Avionics R&D Center，Guangzhou Hangxin Aviation Technology Co., Ltd .