A sensor made by utilizing the piezoresistive effect of single crystal silicon material and integrated circuit technology. When a single crystal silicon material is acted upon by a force, its resistivity changes, and an electrical signal output proportional to the force change can be obtained through a measurement circuit; when force acts on the silicon crystal, the crystal lattice deforms, causing carriers to Scattering from one energy valley to another energy valley causes the mobility of carriers to change, disturbing the average amount of carriers longitudinally and transversely, thus causing the resistivity of silicon to change; 4 piezoresistors are connected to form a whith The energized bridge provides an electrical output proportional to the voltage being measured. 

MEMS-based pressure sensor chips are mainly used in the following fields: medical equipment, various pumps and compressors, various air conditioning and ventilation systems, and hydraulic and pneumatic devices.

The main research direction of this project focuses on the development of sensitive components, mainly focusing on: 

A. Study the manufacturing process of diffused silicon MEMS pressure sensors, and simulate and analyze the sensitivity of the bare chip of the sensor based on finite element analysis; 

B. Packaging of pressure sensor. The selection of packaging materials and the design of the structure were optimized using a combination of finite element analysis and experiments.