Semiconductor Integrated Circuits and Precision Instrument Equipment

Magnetic Signature Imaging and Current Density Imaging Scanners

The 3C industry market size exceeds one trillion US dollars. Focusing on industry pain points such as difficulty in fault diagnosis, low efficiency, slow debugging and high threshold for practitioners in the development, quality inspection, maintenance and after-sales aspects of complete machine 3C products, this research has made breakthroughs in high-precision magnetic sensor linear array scanning information synchronization and electromagnetic noise suppression technology. A high-efficiency, high-precision, highly portable, low-cost, and strong-penetrating non-destructive scanning imager for magnetic characteristics and current density was developed. It can realize rapid magnetic feature scanning imaging and obtain the current density distribution intensity and direction image inside the device. More mature image feature recognition and deep learning technologies can be used to anchor fault types and quickly diagnose faults. The scanner prototype is shown in Figure 8.3.

 

The application effect is shown in Figure 8.4-8.6.